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advance data sheet may 2000 smc/smw dual-output series surface-mount power modules: 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w the smc/smw dual-output series surface-mount power modules use advanced, surface-mount technology and deliver high-quality, compact, dc-dc conversion at an eco- nomical price. applications n communication equipment n computer equipment n distributed power architectures options n negative remote on-off logic n synchronization n tight output voltage regulation n input voltage turn-on adjustment * ul is a registered trademark of underwriters laboratories, inc. ? csa is a registered trademark of canadian standards associa- tion. vde is a trademark of verband deutscher elektrotechniker e.v. this product is intended for integration into end-use equipment. all the required procedures for ce marking of end-use equip- ment should be followed. (the ce mark is placed on selected products.) features n low pro?e: 10 mm x 30.2 mm x 49.5 mm (0.39 in. x 1.19 in. x 1.95 in.) n wide input voltage range: 18 vdc to 36 vdc and 36 vdc to 75 vdc n input-to-output isolation: 1500 v n operating case temperature range: ?0 c to +105 c n overcurrent protection, unlimited duration n remote on/off n output voltage adjustment: 90% to 105% of v o, nom n output overvoltage protection n undervoltage lockout n ul * 1950 recognized, csa ? c22.2 no. 950-95 certi?d, vde 0805 (en60950, iec950) licensed n ce mark meets 73/23/eec and 93/68/eec directives ? (smw only) n within fcc class a radiated limits description the smc/smw dual-output series surface-mount power modules are low-pro?e, dc-dc converters that operate over an input voltage range of 18 vdc to 36 vdc or 36 vdc to 75 vdc and provide a precisely regulated output. the output is isolated from the input, allowing versatile polarity con?urations and grounding connections. the modules have a maxi- mum power rating of 10 w and ef?iencies up to 80%. built-in ?tering for both input and output mini- mizes the need for external ?tering. these modules are designed and manufactured to be gull-winged surface-mounted power modules that are re?wed with other surface-mount components in a typical surface-mount fashion.
2 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: absolute maximum ratings stresses in excess of the absolute maximum ratings can cause permanent damage to the device. these are abso- lute stress ratings only. functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. exposure to absolute maximum ratings for extended periods can adversely affect device reliability. * maximum case temperature varies based on power dissipation. see derating curves, figure 14, for details. electrical speci?ations unless otherwise indicated, speci?ations apply over all operating input voltage, resistive load, and temperature conditions. table 1. input speci?ations fusing considerations caution: this power module is not internally fused. an input line fuse must always be used. this encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. to preserve maximum ?xibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. the safety agencies require a normal-blow fuse with a maximum rating of 5 a (see safety considerations section). based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. refer to the fuse manufacturers data for further information. parameter device symbol min typ max unit input voltage: continuous transient (100 ms) smc smw smw v i v i v i, trans 0 0 0 50 80 100 vdc vdc v operating case temperature (see thermal considerations section.) all t c ?0 105* c storage temperature all t stg ?5 120 c i/o isolation voltage all 1500 vdc parameter device symbol min typ max unit operating input voltage smc smw v i v i 18 36 24 48 36 75 vdc vdc maximum input current (v i = 0 to v i, max ; i o = i o, max ) smc smw i i, max i i, max 1.2 0.6 a a inrush transient all i 2 t 0.2 a 2 s input re?cted-ripple current (5 hz to 20 mhz; 12 m h source imped- ance; t a = 25 c; see figure 7.) all i i 5 map-p input ripple rejection (100 hz?20 hz) all 45 db
lucent technologies inc. 3 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: electrical speci?ations (continued) table 2. output speci?ations parameter device code or suf? symbol min typ max unit output voltage set point (v i = v i, nom ; i o = i o, max ; t a = 25 c) aj bk cl v o1, set v o2, set v o1, set v o2, set v o1, set v o2, set 4.75 ?.75 11.40 ?1.40 14.25 ?4.25 5.0 ?.0 12.0 ?2.0 15.0 ?5.0 5.25 ?.25 12.60 ?2.60 15.75 ?5.75 vdc vdc vdc vdc vdc vdc output voltage (over all line, load, and temperature conditions until end of life; see figure 9.) aj bk cl v o1 v o2 v o1 v o2 v o1 v o2 4.5 ?.5 10.80 ?0.80 13.50 ?3.50 5.5 ?.5 13.20 ?3.20 16.50 ?6.50 vdc vdc vdc vdc vdc vdc output regulation (for line and load see characteristic curves.) all output ripple and noise (across 2 x 0.47 m f ceramic capacitors; see figure 8.): rms peak-to-peak (5 hz to 20 mhz) aj bk, cl aj bk, cl 35 50 120 150 mvrms mvrms mvp-p mvp-p output current (at i o < i o, min , the modules may exceed output ripple speci?ations, but operation is guaranteed.) aj bk cl i o1 , i o2 i o1 , i o2 i o1 , i o2 0.1 0.06 0.05 1.0 0.42 0.33 a a a output current-limit inception (v o = 90% v o, set ) aj bk cl i o1 , i o2 i o1 , i o2 i o1 , i o2 4.0 2.5 2.5 a a a output short-circuit current (v o = 0.25 v) aj bk cl i o1 , i o2 i o1 , i o2 i o1 , i o2 6.0 3.5 3.5 a a a ef?iency (v i = v i, nom ; i o = i o, max ; t a = 25 c; see figure 9.) smc010xx smw010aj smw010bk smw010cl h h h h tbd tbd 76 76 77 78 79 79 % % % % switching frequency all 265 khz
4 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: electrical speci?ations (continued) table 2. output speci?ations (continued) table 3. isolation speci?ations table 4. general speci?ations parameter device code or suf? symbol min typ max unit dynamic response (for duals: i o1 or i o2 = i o, max ; d i o / d t = 1a/10 m s; v i = v i, nom ; t a = 25 c): load change from i o = 50% to 75% of i o, max : peak deviation settling time (v o < 10% of peak deviation) load change from i o = 50% to 25% of i o, max : peak deviation settling time (v o < 10% of peak deviation) all all all all 2 1.5 2 1.5 %v o, set ms %v o, set ms parameter min typ max unit isolation capacitance 600 pf isolation resistance 10 m w parameter min typ max unit calculated mtbf (i o = 80% of i o, max ; t c = 40 c) 4,860,000 hours weight 30 (1.05) g (oz.)
lucent technologies inc. 5 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: electrical speci?ations (continued) table 5. feature speci?ations parameter device code or suf? symbol min typ max unit remote on/off signal interface (optional): (v i = 0 v to v i , max ; open collector or equivalent compatible; signal referenced to v i (? terminal. see figure 10 and feature descriptions.): positive logic?if device code suf? ? is not speci?d: logic low?odule off logic high?odule on negative logic?device code suf? ?? logic low?odule on logic high?odule off module speci?ations: on/off current?ogic low on/off voltage: logic low logic high (i on/off = 0) open collector switch speci?ations: leakage current during logic high (v on/off = 10 v) output low voltage during logic low (i on/off = 1 ma) all all all all all i on/off v on/off v on/off i on/off v on/off ?.7 1.0 1.2 10 50 1.2 ma v v m a v turn-on delay and rise times (at 80% of i o, max ; t a = 25 c): case 1: on/off input is set for unit on and then input power is applied (delay from point at which v i = v i, min until v o = 10% of v o, nom ). case 2: input power is applied for at least one second, and then the on/off input is set to turn the module on (delay from point at which on/off input is toggled until v o = 10% of v o, nom ). output voltage rise time (time for v o to rise from 10% of v o, nom to 90% of v o, nom ) output voltage overshoot (at 80% of i o, max ; t a = 25 c) all all all all t delay t delay t rise 5 1 0.2 20 10 5 5 ms ms ms % output voltage set-point adjustment range aj bk, cl 90 90 110 100 %v o, nom %v o, nom output overvoltage protection (clamp) aj bk cl v o1, clamp v o2, clamp v o1, clamp v o2, clamp v o1, clamp v o2, clamp 5.6 ?.6 13.2 ?3.2 16.6 ?6.6 7.0 ?.0 18.0 ?8.0 22.0 ?2.0 v v v v v v undervoltage lockout smc smw v uvlo v uvlo 11 20 14 27 v v
advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: 6 lucent technologies inc. characteristic curves 8-1790(c) note: output 2 has characteristics similar to output 1 when i o1 = 0.5 a and i o2 varies. figure 1. smx010aj typical load regulation of output1 with fixed i o2 = 0.5 a at t c = 25 c 8-1791(c) note: output 2 has characteristics similar to output 1 when i o2 = 0.1 a and i o1 varies. figure 2. smx010aj typical cross regulation, v o1 vs. i o2 with fixed i o1 = 0.1 a at t c = 25 c 8-1792(c) note: output 2 has characteristics similar to output 1 when i o2 = 1.0 a and i o1 varies. figure 3. smx010aj typical cross regulation, v o1 vs. i o2 with fixed i o1 = 1.0 a at t c = 25 c 8-1793(c) note: output 2 has characteristics similar to output 1 when i o1 = (0.5 * i o, max ) and i o2 varies. figure 4. smx010bk, cl load regulation of output1 with fixed i o2 = 0.5 * i o, max at t c = 25 c, normalized v o1 vs. normalized current i o1 0.1 0.2 0.3 0.4 0.5 0.6 4.90 5.05 output current 1, i o1 ( a ) 5.00 5.10 1.0 0.0 4.95 0.7 5.15 0.8 0.9 v i = high line v i = low line v i = nom line output voltage 1, v o1 (v) 0.1 0.2 0.6 0.7 0.8 0.9 4.95 5.20 output current 2, i o2 ( a ) 5.10 5.05 5.15 1.0 0.0 5.25 5.00 0.4 0.5 0.3 v i = low line v i = nom line v i = high line output voltage 1, v o1 (v) 0.1 0.2 0.3 0.5 0.6 0.7 4.75 4.90 output current 2, i o2 ( a ) 4.85 4.95 1.0 0.0 4.80 0.8 0.9 5.00 0.4 output voltage 1, v o1 (v) v i = high line v i = nom line v i = low line 0.15 0.30 0.45 0.75 0.90 0.990 1.013 normalized output current ( i o1 /i o1 , max ) 1.010 1.016 1.0 5 0.0 1.006 1.020 0.60 1.003 1.000 0.996 0.993 v i = high line i o = i o , max i o = i o , min v i = low line v i = nom line normalized output voltage 1 (v o1 /v o1 , set )
advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: lucent technologies inc. 7 characteristics curves (continued) 8-1794(c) note: output 2 has characteristics similar to output 1 when i o2 = i o, min and i o1 varies. figure 5. smx010bk, cl typical cross regulation, normalized v o1 vs. normalized i o2 with fixed i o1 = i o, min at t c = 25 c 8-1795(c) note: output 2 has characteristics similar to output 1 when i o2 = i o, max and i o1 varies. figure 6. smx010bk, cl typical cross regulation, normalized v o1 vs. normalized i o2 with fixed i o1 = i o, max at t c = 25 c test con?urations 8-203(c) note: input re?cted-ripple current is measured with a simulated source impedance of 12 m h. capacitor cs offsets possible battery impedance. current is measured at the input of the module. figure 7. input re?cted-ripple test setup 8-808(c).g note: use four 0.47 m f ceramic capacitors. scope measurement should be made using a bnc socket. position the load between 50 mm and 75 mm (2 in. and 3 in.) from the module. figure 8. peak-to-peak output noise measurement test setup 1.020 1.003 0.996 1.010 1.016 1 . 023 1.000 1.007 1.013 0.15 0.45 0.60 0.75 0.90 1.05 0.0 0.30 normalized output current 2 (i o2 /i o2 , max ) v i = nom line v i = low line v i = high line i o = i o , min i o = i o , max normalized output voltage 1 (v o1 /v o1 , set ) 1.000 0.966 0.953 0.980 0.993 1 . 006 0.960 0.973 0.987 0.15 0.45 0.60 0.75 0.90 1.05 0.0 0.30 normalized output current 2 (i o2 /i o2 , max ) normalized output voltage 1 (v o1 /v o1 , set ) v i = low line v i = nom line v i = high line i o = i o , max i o = i o , min to oscilloscope 12 ? c s 220 ? impedance < 0.1 w @ 20 c, 100 khz v i (+) v i (? battery 33 ? current probe l test v o1 (+) v o2 (+) 0.47 ? 0.47 ? scope copper strip scope com r load1 r load2 0.47 ? 0.47 ?
8 8 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: test con?urations (continued) 8-863(c).a note: all measurements are taken at the module terminals. when socketing, place kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. figure 9. output voltage and ef?iency measurement test setup design considerations input source impedance the power module should be connected to a low ac-impedance input source. highly inductive source impedances can affect the stability of the power mod- ule. if the source inductance exceeds 4 m h, a 33 m f electrolytic capacitor (esr < 0.7 w at 100 khz) mounted close to the power module helps ensure stability of the unit. solder recommendations large surface-mount components typically require a thicker stencil than smaller components to ensure a reliable solder joint. the smc/smw-series surface- mount power modules have been evaluated for solder joint reliability and shock and vibration requirements using 170,000 cubic mils (2.8 mm 3 ) of solder. this vol- ume can be obtained by printing solder 12 mils thick on the copper pads on overprinting the copper pads 13 mils (0.33 mm) around the pad area with 8 mils of printed solder. although this volume is recommended, tests have been conducted using lower volumes with successful results. contact technical support for further assistance. safety considerations smc modules for safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., ul 1950, csa c22.2 no. 950-95, and vde 0805 (en60950, iec950). for the converter output to be considered meeting the requirements of safety extra-low voltage (selv), the input must meet selv requirements. the power module has extra-low voltage (elv) outputs when all inputs are elv. the input to these units is to be provided with a maxi- mum 5 a normal-blow fuse in the ungrounded lead. smw modules for safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., ul 1950, csa c22.2 no. 950-95, and vde 0805 (en60950, iec950). if the input source is non-selv (elv or a hazardous voltage greater than 60 vdc and less than or equal to 75 vdc), for the module's output to be considered meeting the requirements of safety extra-low voltage (selv), all of the following must be true: n the input source is to be provided with reinforced insulation from any other hazardous voltages, includ- ing the ac mains. n one v i pin and one v o pin are to be grounded, or both the input and output pins are to be kept ?ating. n the input pins of the module are not operator acces- sible. n another selv reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output. note: do not ground either of the input pins of the module without grounding one of the output pins. this may allow a non-selv voltage to appear between the output pins and ground. v i (+) i i i o supply contact resistance contact and distribution losses load v i (? v o1 v o2 com load h v oj com [] i oj j1 = 2 ? v i + () v i () [] i i -------------------------------------------------- - x 100 % =
lucent technologies inc. 9 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: safety considerations (continued) smw modules (continued) the power module has extra-low voltage (elv) outputs when all inputs are elv. the input to these units is to be provided with a maxi- mum 5 a normal-blow fuse in the ungrounded lead. feature descriptions overcurrent protection to provide protection in a fault (output overload) condi- tion, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlim- ited duration. at the point of current-limit inception, the unit shifts from voltage control to current control. if the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). the unit operates normally once the output current is brought back into its speci?d range. remote on/off two remote on/off options are available. positive logic (if device code suf? ? is not speci?d) remote on/off turns the module on during a logic-high voltage on the remote on/off pin, and off during a logic low. nega- tive logic, device code suf? ?, remote on/off turns the module off during a logic high and on during a logic low or when the remote on/off pin is shorted to the v i (? pin. to turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the v i (? terminal (v on/off ). the switch may be an open collector or equivalent (see figure 10). a logic low is v on/off = ?.7 v to 1.2 v. the maximum i on/off during a logic low is 1 ma. the switch should maintain a logic-low voltage while sinking 1 ma. during a logic high, the maximum v on/off generated by the power module is 10 v. the maximum allowable leakage current of the switch at v on/off = 10 v is 50 m a. the module has internal capacitance to reduce noise at the on/off pin. additional capacitance is not gen- erally needed and may degrade the start-up character- istics of the module. if not using the remote on/off feature, perform one of the following: for negative logic, short the on/off pin to v i (?. for positive logic, leave the on/off pin open (?at- ing). 8-758(c).a figure 10. remote on/off implementation output voltage adjustment output voltage set point adjustment allows the user to increase or decrease the output voltage set point of a module. this is accomplished by connecting an exter- nal resistor between the trim pin and either the v o (+) or v o (? pins. with an external resistor between the trim and v o (+) pins (r adj-down ), the output voltage set point (v o, adj ) decreases (see figure 11). the following equation determines the required external resistor value to obtain an output voltage change from v o, nom to v o, adj : where r adj-down is the resistance value connected between trim and v o (+), and g, h, and l are de?ed in the table below. 8-715(c).j figure 11. circuit con?uration to decrease output voltage + i on/off v on/off remote on/off v i (+) v i (? r adj-down v o adj , l () g v o nom , v o adj , () --------------------------------------- h w = v i (+) v i (? v o1 (+) v o2 (? trim r adj-down r load1 com r load2
10 10 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: feature descriptions (continued) output voltage adjustment (continued) with an external resistor connected between the trim and v o (? pins (r adj-up ), the output voltage set point (v o, adj ) increases (see figure 12). the following equa- tion determines the required external resistor value to obtain an output voltage from v o, nom to v o, adj : where r adj-up is the resistance value connected between trim and v o (?, and the values of g, h, k, and l are shown in the following table. although the aj output can be trimmed up, with mis- matched loads, the output voltage on the lightly loaded output will increase. the output voltage between the com pin and both the v o1 (+) and v o2 (? pins must be kept lower than the minimum overvoltage protection voltage found in the feature speci?ations table. the bk and cl modules can only be trimmed down. 8-715(c).k figure 12. circuit con?uration to increase output voltage the smc/smw-series surface-mount power modules have a ?ed current-limit set point. therefore, as the output voltage is adjusted down, the available output power is reduced. in addition, the minimum output cur- rent is a function of the output voltage. as the output voltage is adjusted down, the minimum required output current can increase (i.e., minimum power is constant). as the output voltage is adjusted up, the output power should be held constant (maximum load current decreases). output overvoltage protection the output overvoltage clamp consists of control cir- cuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. this con- trol loop has a higher voltage set point than the primary loop (see feature speci?ations table). in a fault condi- tion, the overvoltage clamp ensures that the output voltage does not exceed v o , clamp , max . this provides a redundant voltage-control that reduces the risk of out- put overvoltage. input voltage turn-on adjustment (optional) the input voltage at which the unit turns on can be adjusted upward to add additional hysteresis between the points at which the modules turn on and turn off. this feature can be useful when the power system has high impedance between the source voltage and the power unit causing the input to drop as the supply is turned on. please consult the factory for application guidelines and/or a description of how to use this fea- ture. synchronization (optional) with external circuitry, the unit is capable of synchroni- zation from an independent time base with a switching rate of 256 khz. other frequencies may be available; please consult the factory for application guidelines and/or a description of the external circuit needed to use this feature. thermal considerations the power module operates in a variety of thermal environments; however, suf?ient cooling should be provided to help ensure reliable operation of the unit. heat-dissipating components inside the unit are ther- mally coupled to the case. heat is removed by conduc- tion, convection, and radiation to the surrounding environment. proper cooling can be veri?d by mea- suring the case temperature. the case temperature (t c ) should be measured at the position indicated in figure 13. ghkl smx010aj 10000 2050 7.5 2.49 smx010bk 45300 2050 2.49 smx010cl 45300 2050 2.49 r adj-up gl v o adj , l () k [] ---------------------------------------- - h ? ?? w = v i (+) v i (? v o1 (+) v o2 (? trim r adj-up r load1 com r load2
advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: lucent technologies inc. 11 thermal considerations (continued) 8-1363(c).d note: dimensions are in millimeters and (inches). pin locations are for reference only. figure 13. smc and smw case temperature measurement location note that the view in figure 13 is of the surface of the module. the temperature at this location should not exceed the maximum case temperature indicated on the derating curves. the output power of the module should not exceed the rated power for the module as listed in the ordering information table. heat transfer characteristics increasing air?w over the module enhances the heat transfer via convection. figure 14 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (t a ) for natural convection through 3.0 ms ? (600 ft./min.). systems in which these power modules are used typi- cally generate natural convection air?w rates of 0.25 ms ? (50 ft./min.) due to other heat-dissipating components in the system. therefore, the natural con- vection condition represents air?w rates of approxi- mately 0.25 ms ? (50 ft./min.). use of figure 14 is shown in the following example. example what is the minimum air?w necessary for an smw010aj operating at v i = 48 v, an output current of 1 a, and a maximum ambient temperature of 84 c? solution: given: v i = 48 v, i o = 1 a (i o, max ), t a = 84 c determine p d (figure 16): p d = 2.50 w determine air?w (figure 14): v = 1 ms ? (200 ft./min.) 8-1375(c).b figure 14. smc010/smw010 forced convection power derating; either orientation 8-1813(c) figure 15. smc010aj, bk, cl typical power dissipation vs. normalized output current at t c = 25 c 1 25 (0.98) 15 (0.59) 50 60 70 80 90 100 110 40 45 55 65 75 85 95 105 0 3.5 1.5 1.0 0.5 2.0 2.5 3.0 max ambient temperature , t a ( c ) maximum case temperature 2.0 ms ? (400 ft./min.) 3.0 ms ? (600 ft./min.) 1.0 ms ? (200 ft./min.) natural convection power dissipation, p d (w) 0.2 0.6 0.7 0.8 0.9 0.0 2.5 normalized output current, i o1 = i o2 [( i o1 + i o2 ) / ( i o1 , max + i o2 , max )] 1.5 1.0 2.0 3.5 1.0 0.1 3.0 0.5 0.4 0.5 0.3 v i = 36 v v i = 24 v v i = 18 v power dissipation, p d (w)
advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: 12 lucent technologies inc. thermal considerations (continued) heat transfer characteristics (continued) 8-1817(c) figure 16. smw010aj, bk, cl typical power dissipation vs. normalized output current at t c = 25 c module derating the derating curves in figure 14 were derived by mea- surements obtained in an experimental apparatus shown in figure 17. note that the module and the printed-wiring board (pwb) that it is mounted on are both vertically oriented. the passage has a rectangular cross section. 8-1126(c).d note: dimensions are in millimeters and (inches). figure 17. experimental test setup surface-mount power module solder re?w recommendation the smc/smw-series surface-mount power modules are constructed with smt (surface-mount technology) components and assembly guidelines. such large mass/low thermal resistance devices heat up slower than typical smt components. it is recommended that the customer review data sheets in order to customize the solder re?w pro?e for application board assembly. it is recommended that a re?w pro?e must be charac- terized for the module on the application board assem- bly. the solder paste type, component, and board thermal sensitivity must be considered in order to form the desired fused solder ?let. the power module leads are plated with tin (sn) solder to prevent corrosion and ensure good solderability. typically, the eutectic solder melts at 183 c, wets the land, and subsequently wicks the device lead. suf?ient time must be allocated to fuse the plating on the lead and ensure a reliable sol- der joint. there are several types of smt re?w technologies currently used in the industry. these surface-mount power modules can be adequately soldered using nat- ural convection, ir (radiant infrared), convection/ir, or forced convection technologies. the surface-mount power module solder re?w pro?e is established by accurately measuring the module gull-wing lead sur- face temperature. 0.2 0.4 0.6 0.8 1.0 0.0 2.5 1.5 1.0 2.0 0.0 3 . 0 0.5 normalized output current, i o1 = i o2 [(i o1 + i o2 )/(i o1 , max + i o2 , max )] v i = 36 v v i = 48 v v i = 60 v power dissipation, p d (w) v i = 75 v air velocity and ambient temperature measured below the module airflow 13 (0.5) facing pwb module 76 (3.0) pwb
lucent technologies inc. 13 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: surface-mount power module solder re?w recommendation (continued) the maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the maximum thermal pro?e limits as shown in figure 18. the lead temperature during a typical re?w pro?e is shown in figure 19. failure to observe these maximum lead temperatures and duration may result in permanent damage to the power module. relative temperatures of the module gull-wing leads vary according to many factors, including surrounding compo- nents, internal paths, and connecting paths. typically, pin 1 is a good choice for a conservative measurement since it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. these vari- ables make it dif?ult to compare various types of surface-mount modules; however, based upon a sampling, the lucent technologies unit has been found to be more robust during temperature pro?es compared with other smt modules available in the industry at the time of this publication. 8-2275(c) figure 18. maximum thermal pro?e limits 8-2274(c).a figure 19. typical re?w soldering pro?e 4 c/s max 90 s max 6 minutes max 230 c max (peak) 183 c 150 c 120 c time (s) gull-wing lead temperature ( c) 2:30 5:00 7:30 10:00 melting point (60/40 solder) 250 200 150 100 50 time ( min. ) gull-wing lead temperature ( c)
14 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: packaging information vacuum formed trays the smc/smw-series surface-mount power modules are delivered in plastic vacuum formed trays (see figure 20) that allow automated placement of the modules via a surface-mount pick and place machine. 8-2263(c) note: dimensions are in millimeters and (inches). figure 20. vacuum formed tray speci?ations: n material: pvc (esd protected) n capacity: 24 pieces/tray n weight: 90 g (3.2 oz.) 216 (8.50) 19 (0.75) 213 (8.37) 212 (8.33) 184 (7.25) 137 (5.40) 90 (3.55) 43 (1.70) 12 (0.48) 4 (0.16) 0.00 1 1 1 1 1 1 848116547 3 (0.11) ls 13 (0.51) 381 (15.00) 165 (6.50) 378 (14.89) 0.00 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 45 (1.78) 105 (4.14) 225 (8.86) 285 (11.22) 345 (13.58)
lucent technologies inc. 15 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: outline diagram dimensions are in millimeters and (inches). see next page for pin descriptions. tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.4 mm (0.015 in.). top view side views bottom view 8-1507(c).e lucent patent pending made in usa smw010cl dc-dc power module in:dc 36-75v, 0.6a out1:dc 15v,0.33a 1 49.5 (1.95) 30.23 (1.19) max out2:dc ?5v,0.33a tuv rheinland vde 1.8 ( 0.07 ) 0.30 0.1 (0.012 0.004) 0.25 (0.010) 9.7 (0.38) 2.0 (0.08) no-slide mechanical retaining pins, 2 places 1.75 (0.069) 38.51 (1.52) 33.50 (1.32) 13.49 (0.53) 35.3 (1.39) 2.5 (0.10) 3.51 (0.138) 43.48 (1.71) 12.07 (0.475) 47.78 (1.881) 8.48 (0.33) 1.27 (0.050) dia
16 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: recommended hole pattern component-side footprint. dimensions are in millimeters and (inches). tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.4 mm (0.015 in.). caution: care must be taken to ensure the board in the periphery of the footprint is ?t. 8-1507(c).e * the recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). see design considerations section. ? n/c may be used for internal module connections and should not be connected by the customer. pin function pin function 1v o1 (+) 12 v i (+) 2 com 11 v i (? 3v o2 (? 10 n/c ? 4 trim 9 sync (optional) 5 n/c ? 8 on/off 6 n/c ? 7 turn-on adjustment (optional) 3.02 (0.119) 30.0 (1.18) 3.3 (0.13) 1.6 (0.063) slot 4.1 (0.16) 5.0 (0.197) 2.8 (0.11) footprint periphery 13.11 (0.516) 36.8 (1.45) 31.2 (1.23) 1.6 (0.063) dia pilot hole, required for guide pin, 1 place pin 1 pad* 43.0 (1.693) 10.0 (0.39) 35.0 (1.38) 40.0 (1.57)
lucent technologies inc. 17 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: ordering information table 6. device codes * smc codes are available upon request only. contact the factory for minimum order size and availability. optional features may be ordered using the device code suf?es shown below. the feature suf?es are listed numerically in descending order. please contact your lucent technologies account manager or application engi- neer for pricing and availability of options. table 7. device options input voltage output voltages output power device code comcode 24 v 5 v, ? v 10 w smc010aj* tbd 24 v 12 v, ?2 v 10 w smc010bk* tbd 24 v 15 v, ?5 v 10 w smc010cl* tbd 48 v 5 v, ? v 10 w smw010aj 108611047 48 v 12 v, ?2 v 10 w smw010bk 108729781 48 v 15 v, ?5 v 10 w smw010cl 108560954 option device code suf? negative logic remote on/off 1
18 lucent technologies inc. advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: notes
lucent technologies inc. 19 advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: notes
advance data sheet may 2000 18 vdc to 36 vdc and 36 vdc to 75 vdc inputs, 10 w smc/smw dual-output series surface-mount power modules: copyright ?2000 lucent technologies inc. all rights reserved printed in u.s.a. may 2000 ds00-002eps printed on recycled paper for additional information, contact your lucent technologies account manager or the following: power systems unit: network products group, lucent technologies inc., 3000 skyline drive, mesquite, tx 75149, usa +1-800-526-7819 (outside u.s.a.: +1-972-284-2626 , fax +1-888-315-5182) (product-related questions or technical assistance) internet: http://www.lucent.com/networks/power e-mail: techsupport1@lucent.com asia pacific: lucent technologies singapore pte. ltd., 750d chai chee road #07-06, chai chee industrial park, singapore 469004 tel. (65) 240 8041 , fax (65) 240 8438 china: lucent technologies (china) co. ltd., scitech place no. 22, jian guo men wai avenue, beijing 100004, prc tel. (86) 10-6522 5566 ext. 4187 , fax (86) 10-6512 3634 japan: lucent technologies japan ltd., mori building no. 21, 4-33, roppongi 1-chome, minato-ku, tokyo 106-8508, japan tel. (81) 3 5561 5831 , fax (81) 3 5561 1616 latin america: lucent technologies inc., room 416, 2333 ponce de leon blvd., coral gables, fl 33134, usa tel. +1-305-569-4722 , fax +1-305-569-3820 europe: data requests: dataline: tel. (44) 7000 582 368 , fax (44) 1189 328 148 technical inquiries:germany: (49) 89 95086 0 (munich), united kingdom: (44) 1344 865 900 (ascot), france: (33) 1 40 83 68 00 (paris), sweden: (46) 8 594 607 00 (stockholm), finland: (358) 9 4354 2800 (helsinki), italy: (39) 02 6608131 (milan), spain: (34) 91 807 1441 (madrid) lucent technologies inc. reserves the right to make changes to the product(s) or information contained herein without notice. n o liability is assumed as a result of their use or application. no rights under any patent accompany the sale of any such product(s) or information.

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